Cover up the heat

掩暧───Cover up the heat

In addition, heat build-up limits the number of channels a single DDI chip can cover, creating an obstacle to reducing the total number of DDI per panel.───同时，内在的热量会限制每个DDI芯片能覆盖的通道，造成减少面板DDI数量上的困难，利用TECOF技术，高清LCD电视的源DDI数量从14个414道DDI减少为8个720道DDI。